文件名称：hot chip 2018 第一天会议材料
文件大小：37.23MB
文件格式：RAR
更新时间：2021-09-19 10:21:56
hot chip 201
hot chip 2018 第一天ppt材料。《Samsung M3 Processor》；《Pixel Visual Core: Google's Fully Programmable Image, Vision, and AI Processor For Mobile Devices》；《SMIV: A 16nm SoC with Efficient and Flexible DNN Acceleration for Intelligent IoT Devices》，《NVIDIA’S XAVIER SOC》；《》
【文件预览】：
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----1.00b_HC30_Welcome_TPC.pdf(43KB)
----1.01_Samsung_Exynos_HotChips_MK_rev2.pdf(2.05MB)
----1.12_Nvidia_XavierHotchips2018Final_814.pdf(1.21MB)
----1.10_Harvard_Whatmough_Hotchips_2018_0.7.pdf(1013KB)
----1.03_Berkeley_BROOM_HC30.Berkeley.Celio.v02.pdf(11MB)
----1.02_Google_HC30.Google.JasonRedgrave.V01.pdf(2.23MB)
----1.13_Microsoft_Hardware_Security_Platform_Behind_Azure_Sphere.pdf(735KB)
----1.07_Hotchips_Security_Keynote.pdf(2.63MB)
----1.14_Google_Titan_GoogleFinalTitanHotChips2018.pdf(4.2MB)
----1.00a_HC30_Welcome_v3.pdf(861KB)
----1.04_Intel_Thin_Light_Gaming_HotChips_SC_Final.pdf(1.16MB)
----1.05_AMD_APU_AMD_Raven_HotChips30_Final.pdf(2.13MB)
----1.11_MIT_Navion_2018_hotchips_navion_slides_r1.pdf(15.59MB)