ELECTROMAGNETIC_COMPATIBILITY_INMICROWAVE_ENGINEERING

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文件名称：ELECTROMAGNETIC_COMPATIBILITY_INMICROWAVE_ENGINEERING
文件大小：2.24MB
文件格式：PDF
更新时间：2015-11-22 04:02:02
EMC ELECTROMAGNETIC COMPATIBILITY IN MICROWAVE ENGINEERING Outline 1.Printed circuit board design 2.Electromagnetic shielding 3.Transients 4.Reverberation camber Common used PCBs •Commonly used PCBs have four layerswhere ICs, modules, and discrete components are mounted on the top and bottom surfaces ,power and ground planes are embedded in the inner two layers, and viasare used as interconnections through layers