【文件属性】：
文件名称：TI公司_逻辑器件选型手册.pdf
文件大小：2.8MB
文件格式：PDF
更新时间：2022-07-14 03:00:49
TI 公司 逻辑器件 选型手册
As the world leader in logic, Texas Instruments (TI) offers a
full spectrum of logic functions and technologies ranging from
the mature bipolar and BiCMOS families to the latest
advanced CMOS families. TI offers process technologies with
the logic performance and features needed in today’s elec-
tronic markets while maintaining support for the traditional
logic products.
TI’s product offerings include the following process technolo-
gies or device families:
•AC, ACT, AHC, AHCT, ALVC, AUC, AUP, AVC, FCT, HC, HCT,
LV-A, LV-AT, LVC, TVC
•ABT, ABTE, ALB, ALVT, BCT, HSTL, LVT
•BTA, CB3Q, CB3T, CBT, CBT-C, CBTLV, FB, FIFOs, GTL, GTLP,
JTAG, I2C, VME
•ALS, AS, F, LS, S, TTL
Some Logic families have been in the marketplace for years,
the oldest well into their fourth decade. The “Logic Migration
Overview” section gives logic users a visual guide to migra-
tion from the older to the newer technologies.
Today’s applications are evolving with greater functionality
and smaller size. TI’s goal is to help designers easily find the
ideal logic technology or function they need. By offering logic
families at every price/performance node along with bench-
mark delivery, reliability and worldwide support, TI maintains
a firm commitment to remain in the market with both leading-
edge and mature logic lines. The “Product Index” section pro-
vides a snapshot of TI’s extensive portfolio by function versus
technology. The “Functional Cross-Reference” section shows
the portfolio by device (type number) versus technology.
Logic suppliers have historically focused on speed and low
power as the priorities for product family improvement. As
shown in Figure 1, fast performance is offered by many new
TI product technologies such as AUC (1.8 V), ALVC (3.3 V) and
0
5
10
15
20
25
0
1
2
3
4
5
6
7
CMOS Voltage, VCC (V)
Typical Propagation Delay, tpd (ns)
HC
AHC
AC
LVA
LVC
ALVC
AVC
AUC
Figure 1. CMOS Voltage vs. Speed
LV-A (5 V), depending on operating voltage requirements.
Other technologies such as AUP focus on delivering “best-in-
class” low-power performance.
The “Packaging and Marking Information” section shows the
wide variety of packaging options offered by TI. Included are
advanced surface-mount packages like the fine-pitch, small-
outline ball-grid-array (BGA) packages, quad flat no-lead
(QFN) packages for gates and octals; and WCSP (NanoStar™/
NanoFree™) packages for single-, dual- and triple-gate
functions. The new NanoStar/NanoFree WCSP packages are
the world’s smallest logic packages, offering a 70% savings in
space over industry-standard SC-70 packages.
The “Resources” section provides additional information
about TI logic families, including a list of technical literature
and an overview of alternate sources for most logic families.
Data sheets can be downloaded from the TI web site at
www.ti.comor ordered through your local sales office or TI
authorized distributor. (See back cover.)