文件名称：东芝emmc芯片手册
文件大小：733KB
文件格式：PDF
更新时间：2021-07-24 04:55:14
eMMC
东芝emmc芯片手册，THGBMBG9D8KBAIG is 64GB density of e-MMC Module product housed in 153ball BGA package. This unit is utilized advanced TOSHIBA NAND flash device(s) and controller chip assembled as Multi Chip Module. THGBMBG9D8KBAIG has an industry standard MMC protocol for easy use.