文件名称：PowerPAD™ Thermally Enhanced Package
文件大小：906KB
文件格式：PDF
更新时间：2014-08-28 16:01:59
PowerPAD™ Thermally Enhanced Package
The PowerPAD™ thermally enhanced package provides greater design flexibility and increased thermal efficiency in a standard size device package. The PowerPAD package’s improved performance permits higher clock speeds, more compact systems and more aggressive design criteria. PowerPAD™ packages are available in several standard surface mount configurations. They can be mounted using standard printed-circuit board (PCB) assembly techniques, and can be removed and replaced using standard repair procedures. To make optimum use of the thermal efficiencies designed into the PowerPAD™ package, the PCB must be designed with this technology in mind. In order to leverage the full thermal performance benefits offered from the PowerPad™ package, the exposed pad must be soldered to the board. This document focuses on the specifics of integrating a PowerPAD™ package into the PCB design.