文件名称：Grain growth behavior in electrodeposited copper foil under nonproportional loading (2010年)
文件大小：357KB
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更新时间：2024-05-31 04:19:09
工程技术 论文
Grain growth behavior in a copper foil under nonproportional loading was investigated. The grain growth density decreased with increasing phase shift between normal stress and shear stress. Moreover,under this condition,grains tended to grow in various di