文件名称：TI产品 Calculating Useful Lifetimes of Embedded Processors
文件大小：523KB
文件格式：PDF
更新时间：2021-11-27 10:58:01
lifetime
适用于TI的产品 This application report provides a methodology for calculating the useful lifetime of TI embedded processors (EP) under power when used in electronic systems. It is aimed at general engineers who wish to determine if the reliability of the TI EP meets the end system reliability requirement. Electro-migration is the primary failure mechanism being modeled.