LED技术及应用_大功率LED散热问题浅析

时间:2015-07-29 05:27:32
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文件名称:LED技术及应用_大功率LED散热问题浅析

文件大小:1.43MB

文件格式:DOC

更新时间:2015-07-29 05:27:32

LED 大功率LED 散热问题

此为课程论文 摘要:如何提高大功率LED的散热能力, 是LED器件封装和器件应用设计要解决的核心问题。本文从LED的热特性分析温度对LED工作性能的影响,得出光通量输出跟结点温度的关系、温度影响LED发光效率和造成发光峰值偏移的原因。由于大功率LED因发热量大,导致工作温度偏高,性能急剧下降,本文指出了开发优良的LED芯片散热技术,才能真正体现LED的优越性,并就大功率LED封装技术中的倒装结构和金属线路板结构等进行对散热问题改善的分析,然后列出常见的几种LED散热模型的特性,并提出了LED散热的其他实现方式。 关键字:LED散热;大功率;热特性; 封装结构; 散热模型 The Brief Analysis of Heat Release in High Power LEDs Abstract: How to improve the heat-sinking capability is one of the key technical problems for the package and application design of device concerned with high-power LEDs. In this paper, we point out the thermal characteristics of LEDs, and the present technical research on heat-release package of high-power LEDs is analyzed, and the trend is summarized. Beside, it suggests that the problem can be solved by other means. Key words: LED ; heat release;thermal characteristics; high-power;package


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