【文件属性】：
文件名称：Practical Guide to the Packaging of Electronics, Second Edition
文件大小：5.49MB
文件格式：PDF
更新时间：2021-05-17 11:27:05
Packaging of Electronics
There are four topics that I categorize under packaging and enclosure
design and analysis. These are electromagnetic, thermal, mechanical,
and thermomechanical analyses. We do not cover electromagnetics
here; however, its importance cannot be overstated. Unfortunately,
much of the analysis for electromagnetic interference (EMI) or electromagnetic compatibility (EMC) is done as an after event. Testing
is done once the system is developed and often coupling and interactions are ignored. EMI is difficult to calculate exactly; however,
back-of-the-envelope estimates may be developed to ensure higher
end-product compliance. Thermal analysis is concerned with calculating the component-critical temperatures. Mechanical analysis is
concerned with the housing of the electronics (from component housing to PCB to enclosure and finally to the rack) as well as the ability
of this housing to maintain its integrity under various loading conditions such as shock and vibration. Thermomechanical management is
concerned with the impact of thermal loads on the mechanical behavior of the system.
In this work, we set the foundation for thermal and mechanical analyses of electronics packaging/enclosure design.