文件名称：IEEE JSSC论文（1月2）
文件大小：28.71MB
文件格式：RAR
更新时间：2014-10-19 13:40:49
IEEE JSSC 论文
IEEE JSSC论文（2011年2、3月），论文权威性无须赘述！因为知道自己在网上查资料的艰辛，股汇总出来大家分享，因为学校对批量下载有处分，这是我自己一篇篇下的，望大家珍惜！
【文件预览】：
1月2
----A QVGA 143 dB Dynamic Range Frame-Free PWM Image Sensor With Lossless Pixel-Level Video Compression and Time-Domain CDS.pdf(2.26MB)
----Palm NMR and 1-Chip NMR.pdf(2.13MB)
----A Power-Efficient 32 bit ARM Processor Using Timing-Error Detection and Correction for Transient-Error Tolerance and Adaptation to PVT Variation.pdf(2.09MB)
----User Customizable Logic Paper (UCLP) With Sea-Of Transmission-Gates (SOTG) of 2-V Organic CMOS and Ink-Jet Printed Interconnects.pdf(2.39MB)
----Within-Die Variation-Aware Dynamic-Voltage-Frequency-Scaling With Optimal Core Allocation and Thread Hopping for the 80-Core TeraFLOPS Processor.pdf(2.46MB)
----Demonstration of Integrated Micro-Electro-Mechanical Relay Circuits for VLSI Applications.pdf(2.5MB)
----An Implantable Optical Stimulation Delivery System for Actuating an Excitable Biosubstrate.pdf(2.17MB)
----Design and Implementation of a Parallel Turbo-Decoder ASIC for 3GPP-LTE.pdf(1.4MB)
----目录.pdf(49KB)
----POWER7™, a Highly Parallel, Scalable Multi-Core High End Server Processor.pdf(3.31MB)
----An x86-64 Core in 32 nm SOI CMOS.pdf(2.19MB)
----A Range Image Sensor Based on 10- Lock-In Pixels in 0.18- m CMOS Imaging Technology.pdf(3.03MB)
----Introduction to the Special Issue on the 2010 IEEE International Solid-State Circuits Conference.pdf(976KB)
----Design Issues and Considerations for Low-Cost 3-D TSV IC Technology.pdf(4.6MB)