文件名称：High-speed Board Design Techniques
文件大小：1.7MB
文件格式：PDF
更新时间：2013-04-30 09:43:12
高速布线规则 AMD 中英文对照 高频高速板设计指南
AMD公司高速板设计指南，PCBlayout必读教程。 INTRODUCTION The most important factor in the design of many systems today is speed. 66-MHz thru 200-MHz processors are common; 233 and 266MHz processors are becoming readily available. The demand for high speed results from: a) the requirement that systems perform complex tasks in a time frame considered comfortable by humans; and b) the ability of component manufacturers to produce high-speed devices. An example of a) is the large amount of information that must be processed to perform even the most rudimentary computer animation. Currently, Programmable Array Logic(PAL®) devices are available with propagation delays of 4.5 ns, and complex PLDs such as MACH® have propagation delays of 5 ns. While this might seem fast, it is not the propagation delay that creates the potential for problems, but rather the fast edge rates needed to obtain the fast propagation delays. In the future, much faster devices will become available, with correspondingly faster edge rates.