文件名称：BGA布线指导.pdf
文件大小：239KB
文件格式：PDF
更新时间：2022-10-01 10:17:52
综合文档
Standard = .010” (250 μm) Hole-to-Copper Imaging - Front-to-Back = /- .002” (50 μm) Lamination - layer-to-layer registration = /- .004” (100 μm) Drill - Drill tolerance = /- .003” (75 μm) Total Tolerance = .009” (225 μm) Advanced = .008” (200 μm) Hole-to-Copper Imaging - Front-to-Back = /- .002” (50 μm) Lamination - layer-to-layer registration = /- .003” (75 μm) Drill - Drill tolerance = /- .002” (50 μm) Total Tolerance = .007” (175 μm)