packaging-chapter-06-databook.pdf

时间:2023-01-04 09:42:35
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文件名称:packaging-chapter-06-databook.pdf

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更新时间:2023-01-04 09:42:35

封装ESD EOS intel

来自intel 关于封装EOS ESD 相关考虑, 从基础开始深入介绍. An overview of electrical static discharge and electrical over stress Electrostatic discharge (ESD) costs the electronics industry millions of dollars each year in damaged components, non-functional circuit boards and scrambled or missing information. ESD can occur in the manufacturing, shipping, receiving, and field handling of integrated circuits or computer boards with no visible signs of damage. A malfunction in these components or boards can occur immediately or the apparatus may perform for weeks, months, or even years before an unpredictable and premature breakdown causes a field failure.


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